Muli-layers Lamination Aluminum Foil Bag for IC Packaging This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.This aluminum foil moisture proof bags are mainly applied to pack electronic components(PCB, IC......
| Product Name | Muli-layers Lamination Aluminum Foil Bag for IC Packaging |
| Material Structure | Layers Laminated Material: PET/AL/NY/PE BOPP/AL/PE |
| Feature | Anti-static, moisture barrier,light isolation |
| Printing | Customized |
| Surface Resistance | 10^8~10^11 Ohm |
| Thickness | Customized(0.06--0.2mm available) |
| Bag Style | Open top/ zip lock/ envelope/ gusset/ three dimensional |
| Package | 50~100pcs per bag and then in cartons or as per customer's request |
| Usage | Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
| NO. | Item | Standard | Result |
| 1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
| 2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
| 3 | Decay time | IEC61340-5-1 | <0.3s |
| 4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
| 5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
| 6 | Heat-Seal Temperature | 160%±10% | |
| 7 | Heat-Seal Pressure | 70Pa | |
| 8 | Heat-Seal Time | ≤1.5S |






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